Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic Composition

  • Amal Mohamed Yassin Ain Shams University
  • Berlent Khalifa Ain Shams University -cairo
  • Reda Ismail
Keywords: Lead-free solder, Sn-Sb alloys, microstructure, creep properties


Particle strengthening was studied in Sn-xSb (x=0.5–3.0 wt. %). Tensile deformation behavior of Sn-2.5 wt.% Sb is investigated at temperature ranging (298 - 343K) and under different constant loads ranging (5.1 - 14.0 MPa). The microstructure characteristics of the tested alloys have been obtained using x-ray diffraction. Morphological studies using optical microscope have been investigated to obtain correlation between the microstructure and mechanical behavior of the alloys. The improved strength is attributed to the uniform distribution of the SnSb intermetallic compound (IMC) inside b-Sn matrix. Based on the obtained stress exponent (n) and activation energy (Q), it is proposed that the dominant deformation mechanism is dislocation climb over the whole temperature range used.


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Author Biographies

Berlent Khalifa, Ain Shams University -cairo

Department of Physics - Faculty of Science - Ain Shams Univeristy

Reda Ismail

Department of Physics, Faculty of Science, Ain Shams Univeristy


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How to Cite
Yassin, A., Khalifa, B., & Ismail, R. (2018). Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic Composition. JOURNAL OF ADVANCES IN PHYSICS, 15, 5970-5982. Retrieved from