Investigation of Microstructure and Creep Properties of Sn-xSb Solder Alloys up to Peritectic Composition
Particle strengthening was studied in Sn-xSb (x=0.5–3.0 wt. %). Tensile deformation behavior of Sn-2.5 wt.% Sb is investigated at temperature ranging (298 - 343K) and under different constant loads ranging (5.1 - 14.0 MPa). The microstructure characteristics of the tested alloys have been obtained using x-ray diffraction. Morphological studies using optical microscope have been investigated to obtain correlation between the microstructure and mechanical behavior of the alloys. The improved strength is attributed to the uniform distribution of the SnSb intermetallic compound (IMC) inside b-Sn matrix. Based on the obtained stress exponent (n) and activation energy (Q), it is proposed that the dominant deformation mechanism is dislocation climb over the whole temperature range used.
A.K. Gain, T. Fouzder, Y.C. Chan, A. Sharif, N.B. Wong, W.K.C. Yung, "The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads", J. Alloys and compounds, 506, (2010), 216-223.
G.S. Zhang, H.Y. Jing, L.Y. Xua, J. Wei, Y.D. Han, creep behavior of eutectic 80Au/20Sn solder alloy, J. Alloy. compd., 476 (2009) 138-141.
S. Kang, A. Sarkhel, "Lead (Pb)-free solders for electronic packaging", J. Electron Mater., 23 (8) (1994) 701-707.
A.N. Fouda, E.A. Eid, "Inflounce of ZnO nano-particles addition on thermal analysis microstructure evaluation and tensile behavior of Sn-5.0 wt.%Sb-0.5wt.%Cu lead –free solder alloy", Mater. Sci. Eng., A 632 (2015) 82-87.
B.A. Khalifa and R. Afify Ismail, "Effect of Heat Treatment on the Mechanical and Microstructure of Sn-3wt.%Sb Alloy", International Journal of Materials Science, vol. 8, 1 (2013) 45-56.
I. Shohji, Y. Toyama, "Effect of strain rate on tensile properties of miniature size specimens of several lead-free alloys", Materials Science Forum, 783-786 (2014) 2810-2815.
K. Kobayashi, I. Shohji, H. Hokazono, "Tensile and fatigue properties of miniature size specimens of Sn-5Sb lead-free solder", Materials Science Forum, Vol. 879 (2016) 2377-2382.
K. Kobayashi, I. Shohji, S. Koyama, H. Hokazono, "Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions", Procedia Engineering, 184 (2017) 238 – 245.
R.M. Shalaby, J. Alloys Compd. 480 (2009) 334–339.
A.A. El-Daly, Y. Swilem, A.E. Hammad, J. Alloys Compd., 471 (2009) 98–104.
R. Novakovic, D. Giuranno, E. Ricci, S. Delsante, D. Li, G. Borzone, Surface Sci., 605 (2011) 248–255.
G. Zeng, S. Xue, Zhang, L. Gao, J. Mater. Sci. Mater. Electron., 22 (2011)565-571.
S.K. Das, A. Sharif, Y.C. Chan, N.B. Wong, W.K.C. Yung, J. Alloys Compd., 481(2009) 167–172.
A.A. El-Daly, A.E. Hammad, Mater. Sci. Eng. A, 527 (2010) 5212–5219.
A.A. El-Daly, A.E. Hammad, J. Alloys Compd., 505 (2010) 793–800.
F.X. Che, W.H. Zhu, S.W. Edith, X.W. Poh, X.R. Zhang, X.W Zhang, J. Alloys Compd., 507 (2010) 215–224.
A. M. Yassin, R.L. Reuben, G. Saad, M.H.N. Beshai, and S.K. Habib, "effect of annealing and microstructure on the creep behavior of an Sn-10wt.% Sb alloy", Proc. Inst. Mech. Eng., vol.213, part 1 (1999) 59-68.
K.L. Murty, F.M. Haggag, and R.K. Mahidhara, J. Electron. Mater., 26 (1997) 839.
P.T. Vianco and D.R. Frear, JOM, 45(7) (1993) 14-20.
M.H.N. Beshaie, S.K. Habib, A.M. Yassin, G. Saad, and M.H. Hasab El-Naby, Cryst. Res. Technol., 34 (1999) 119-123.
R.J. McCabe and M.E. Fine, J. Electron. Mater. 31 (2002) 1276-1280.
Wade, K. Wu, J. Kuni, S. Yamada, and K. Miyahara J. Electron. Mater., 30 (2001) 1228-1232.
Dias Marcelino, Thiago A Costa, Bismarck L. Silva, Jose E. Speneli, Noe Cheung, Amauri Garcia. "A comparative analysis of micro structural features, tensile properties and wettability of hypo peritectic and peritectic Sn-Sb solder alloys", Microelectronics reliability, 81 (2018) 150-158.
B.A. Khalifa, R. Afify Ismail, A. M. Yassin, "Structure Analysis, Enhancement of Creep Resistance and Thermal Properties of Eutectic Sn-Ag Lead-Free Solder Alloy by Ti and Cd Additions", Journal of advance physics, 13, 8 (2017) 2347-2387.
E.A. Eid, A.N. Fouda , El-Shazly M. Duraia, "Effect of adding 0.5 wt% ZnO nano particles, temperature and strain rate on tensile properties of Sn-5.0wt.%Sb-0.5wt.%Cu (SSC505) lead free solder alloy, Materials science & Engineering A 657 (2016) 104 - 114.
Dias Marcelino, Thiago Costa, Otavio Rocha, Jose E. Spinelli, Noe Cheung, Amauri Garcia, "Interconnection of thermal parameters, Microstructure and mechanical properties in directionally solidified Sn-Sb lead free solder alloys" Materials Characterization, 106 (2015) 52-61.
M.M. El-Bahay, M.E. El-Mossalamy, M. Mahdy, and A.A. Bahgat, " Study of the Mechanical and Thermal Properties of Sn-5wt.% Sb solder alloy at two annealing temperatures", Phy. Stat. Sol. (a) 198, No.1, (2003) 76-90.
M. Mathew, H. Yang, S. Movva, K. Murty, Metall. Mater. Trans. 36A (2005) 99 - 104.
Copyright (c) 2018 JOURNAL OF ADVANCES IN PHYSICS
This work is licensed under a Creative Commons Attribution 4.0 International License.
Authors retain the copyright of their manuscripts, and all Open Access articles are distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided that the original work is properly cited.